{"id":350,"date":"2022-07-16T18:03:52","date_gmt":"2022-07-16T16:03:52","guid":{"rendered":"https:\/\/senikompiuteriai.lt\/?p=350"},"modified":"2022-07-16T18:03:54","modified_gmt":"2022-07-16T16:03:54","slug":"elektronikos-komponentu-korpusai","status":"publish","type":"post","link":"https:\/\/senikompiuteriai.lt\/en\/elektronikos-komponentu-korpusai\/","title":{"rendered":"Elektronikos komponent\u0173 korpusai"},"content":{"rendered":"

Kompiuteri\u0173 ir mobili\u0173j\u0173 \u012frengini\u0173 pasaulis – tai pirmiausia yra elektronikos pasaulis. Elektronikos pasaulis – tai daugyb\u0117 pa\u010di\u0173 \u012fvairiausi\u0173 atskir\u0173 komponent\u0173. \u0160itame straipsnyje mes nesigilinsime \u012f komponent\u0173 pavadinimus, tipus ir j\u0173 paskirt\u012f. \u010cia mes ap\u017evelgsime pasyvi\u0173 ir aktyvi\u0173 elektronikos komponent\u0173 korpusus. Komponent\u0173 korpus\u0173 pavadinimus naudinga \u017einoti kada mes kalbame apie tam tikr\u0173 procesori\u0173 ir mikroschem\u0173 modelius. Taip pat tai yra labai svarbu, kai mes remontuojame elektronik\u0105. Tad toliau straipsnyje – elektronikos komponent\u0173 korpusai.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Komponento korpusas. Kas tai? <\/h4>\n\n\n\n

Komponento korpusas – tai savoti\u0161kas elektronikos komponento „\u012fpakavimas” arba dar kitaip „apvalkalas”. Pats komponentas da\u017eniausiai negali „kaboti” ore be papildomos apsaugos. Komponent\u0105 yra b\u016btina \u012f ka\u017ek\u0105 „\u012fpakuoti” (surinkti), kad toliau j\u012f galima b\u016bt\u0173 saugiai panaudoti. Komponentus talpina \u012f korpusus komponent\u0173 gamyklose. Tai yra gana sud\u0117tingas procesas. Ta\u010diau jeigu t\u0105 apra\u0161yti labai trumpai – komponent\u0105 da\u017eniausiai tiesiog patalpina \u012f plastikin\u012f korpus\u0105 (u\u017eliejant komponent\u0105 kar\u0161tu plastiku). Taip pat pasitaiko keramikini\u0173 ir stiklini\u0173 korpus\u0173. Pavyzd\u017eiui, elektronikoje dominuojanti dalis kondensatori\u0173 – SMD keramikiniai. Taip jie vadinasi tod\u0117l, kad j\u0173 korpusai yra pagaminti i\u0161 keramikos. Korpus\u0173 tip\u0173 yra labai daug. \u010cia kaip su baterijomis. Yra daugyb\u0117 j\u0173 variacij\u0173. Pavyzd\u017eiui: D, C, AA, AAA, CR2032, CR2025, CR2016, PP3 ir t.t. <\/p>\n\n\n\n

Pasyv\u016bs ir aktyv\u016bs komponentai<\/h4>\n\n\n\n

Elektronikos pasaulyje komponentai skirstomi \u012f 2 pagrindines kategorijas. Tai yra pasyv\u016bs komponentai ir aktyv\u016bs. Pasyv\u016bs komponentai yra tie, kurie sunaudoja arba saugo energij\u0105. Aktyv\u016bs komponentai yra tie, kurie teikia, valdo arba net gamina energij\u0105. Jeigu dar papras\u010diau, tai aktyv\u016bs komponentai – valdo, pasyv\u016bs – yra pavald\u016bs. Aktyv\u016bs komponentai – tai da\u017eniausiai puslaidininkiai (diodai, tranzistoriai, mikroschemos ir t.t.). Pasyv\u016bs komponentai – var\u017eos (rezistoriai), kondensatoriai ir induktoriai.<\/p>\n\n\n\n

SMD ir THT<\/h4>\n\n\n\n

Dar vienas svarbus dalykas – suskirstyti komponentus ne tik \u012f pasyvius ir aktyvius, bet dar ir \u012f SMD ir THT.<\/p>\n\n\n\n

SMT <\/strong>– Surface mount technology. Lietuvi\u0161kai – pavir\u0161inio montavimo technologija.
SMD <\/strong>– Surface mount devices. Lietuvi\u0161kai – pavir\u0161inio montavimo komponentai (\u012frenginiai).
THT <\/strong>– Through Hole Technology. Lietuvi\u0161kai – i\u0161vadiniai komponentai, kurie yra veriami \u012f plok\u0161tes skyles.<\/p>\n\n\n\n

\u0160itame straipsnyje ap\u017evelgsime THT ir SMD (pavir\u0161inio montavimo) pasyvi\u0173 ir aktyvi\u0173 komponent\u0173 korpusus. Ta\u010diau daugiau d\u0117mesio skirsime SMD komponentams. Kod\u0117l? Tod\u0117l, kad dabar \u0161ita kategorija komponent\u0173 yra dominuojanti. Toki\u0173 komponent\u0173 elektronikoje yra daugiausia. Pavir\u0161inis komponent\u0173 montavimo tipas (SMT technologija) – m\u016bs\u0173 dabartis. THT komponentai vis dar yra naudojami elektronikoje, ta\u010diau jie pasitaiko vis re\u010diau. I\u0161vadinius (THT) komponentus naudoja ten, kur reikalingi dideli galingumai (ir\/ar talpos) arba tvirtas jungties kontaktas su PCB plok\u0161te.<\/p>\n\n\n\n

THT komponent\u0173 korpusai<\/h4>\n\n\n\n

SIP <\/strong>– Single in-line package. Vienos i\u0161vad\u0173 eil\u0117s korpusas.
DIP <\/strong>– Dual in-line package. Dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas.
CDIP <\/strong>– Ceramic DIP. Keramikinis dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas.
CERDIP <\/strong>– Glass-sealed ceramic DIP. Stiklinis dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas.
QIP <\/strong>– Quadruple in-line package. Kaip ir DIP korpusas, tik i\u0161vadai i\u0161d\u0117lioti zigzagu.
SKDIP <\/strong>– Skinny DIP. Dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas. Kartais su plonesniais i\u0161vadais ar smulkesniu \u017eingsniu.
SDIP <\/strong>– Shrink DIP. Nestandartinis dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas su smulkesniu \u017eingsni\u0173.
ZIP <\/strong>– Zig-zag in-line package. THT komponentas su i\u0161vadais, kurie suformuoti zigzagu.
MDIP <\/strong>– Molded DIP. U\u017elietas dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas.
PDIP <\/strong>– Plastic DIP. Plastikinis dviej\u0173 i\u0161vad\u0173 eili\u0173 korpusas.<\/p>\n\n\n\n

SMD komponent\u0173 korpusai<\/h4>\n\n\n\n

CCGA <\/strong>– Ceramic column-grid array (CGA). Keramikinis korpusas, i\u0161vad\u0173 masyvas (matrica).
CGA <\/strong>– Column-grid array. I\u0161vad\u0173 masyvas (matrica).
CERPACK <\/strong>– Ceramic package. Keramikinis korpusas.
LLP <\/strong>– Lead-less lead-frame package. Korpusas neturintis ilg\u0173 i\u0161vad\u0173, metriniu kontakt\u0173 (lydvie\u010di\u0173) paskirstymu (0,5\u20130,8 mm \u017eingsnis).
LGA <\/strong>– Land grid array. Lydvie\u010di\u0173 masyvas (matrica).
LTCC <\/strong>– Low-temperature co-fired ceramic. Korpusas, kurio visa keramin\u0117 laikan\u010dioji konstrukcija ir bet kokios laid\u017eios, var\u017ein\u0117s ir dielektrin\u0117s med\u017eiagos yra kaitinamos krosnyje vienu metu.
MCM <\/strong>– Multi-chip module. Modulis i\u0161 keli\u0173 atskir\u0173 lust\u0173.
MICRO SMDXT<\/strong> – Micro surface-mount device extended technology. Pavir\u0161inio montavimo i\u0161pl\u0117stin\u0117 technologija (spec. mikro korpusai).<\/p>\n\n\n\n

Chip carrier (lusto laikiklis)<\/h4>\n\n\n\n

BCC <\/strong>– Bump chip carrier. Lusto laikiklis (korpusas) su atramomis.
CLCC <\/strong>– Ceramic lead-less chip carrier. Lusto laikiklis (korpusas) be ilg\u0173 i\u0161vad\u0173, keramikinis.
LCC <\/strong>– Lead-less chip carrier. Lusto laikiklis (korpusas) be ilg\u0173 i\u0161vad\u0173.
LCC <\/strong>– Leaded chip carrier. Lusto laikiklis (korpusas) su trumpais i\u0161vadais (kontaktais).
LCCC <\/strong>– Leaded ceramic-chip carrier. Lusto laikiklis (korpusas) su trumpais i\u0161vadais (kontaktais), keramikinis.
DLCC <\/strong>– Dual lead-less chip carrier (ceramic). Dvigubas lusto laikiklis (korpusas) be ilg\u0173 i\u0161vad\u0173, keramikinis.
PLCC <\/strong>– Plastic leaded chip carrier. Plastikinis lusto laikiklis (korpusas) su trumpais i\u0161vadais (kontaktais).<\/p>\n\n\n\n

Pin grid arrays (i\u0161vad\u0173 matricos arba i\u0161vad\u0173 masyvai)<\/h4>\n\n\n\n

OPGA <\/strong>– Organic pin-grid array. I\u0161vad\u0173 (strypeli\u0173) matrica organinio plastiko korpuse.
FCPGA <\/strong>– Flip-chip pin-grid array. I\u0161vad\u0173 (strypeli\u0173) matrica, kurioje lustas sumontuotas pagrindine dalimi \u012f matricos pus\u0119.
PAC <\/strong>– Pin array cartridge. I\u0161vad\u0173 (strypeli\u0173) r\u0117melis (kartrid\u017eas).
PGA <\/strong>– Pin-grid array. I\u0161vad\u0173 (strypeli\u0173) matrica. Taip pat \u017einomas kaip PPGA.
CPGA <\/strong>– Ceramic pin-grid array. I\u0161vad\u0173 (strypeli\u0173) matrica keramikiniame korpuse.<\/p>\n\n\n\n

Flat packages (plok\u0161ti korpusai)<\/h4>\n\n\n\n

CFP <\/strong>– Ceramic flat-pack. Keraminis plok\u0161\u010dias korpusas.
CQFP <\/strong>– Ceramic quad flat-pack. Keraminis plok\u0161\u010dias keturkampis (kvadratinis) korpusas. Pana\u0161us \u012f PQFP.
BQFP <\/strong>– Bumpered quad flat-pack. Plok\u0161\u010dias keturkampis (kvadratinis) korpusas su atramomis.
DFN<\/strong> – Dual flat-pack No lead. Dvigubas plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173.
ETQFP<\/strong> – Exposed thin quad flat-package. Atidengtas plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas.
PQFN<\/strong> – Power quad flat-pack No-leads. Keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173, su atidengtu lusto pagrindu geresniam au\u0161inimui. PQFN – didel\u0117s galios komponent\u0173 korpusas.
PQFP <\/strong>– Plastic quad flat-package. Plastikinis plok\u0161\u010dias keturkampis (kvadratinis) korpusas.
LQFP<\/strong> – Low-profile quad flat-package. \u017demo profilio plok\u0161\u010dias keturkampis (kvadratinis) korpusas.
QFN <\/strong>– Quad flat no-leads package. Keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173. Taip pat vadinamas kaip „micro lead frame” (MLF).
QFP <\/strong>– Quad flat package. Keturkampis (kvadratinis) plok\u0161\u010dias korpusas.
MQFP <\/strong>– Metric quad flat-pack. Keturkampis (kvadratinis) plok\u0161\u010dias korpusas, kurio i\u0161vad\u0173 tarpai apskai\u010diuoti pagal metrin\u0119 sistem\u0105.
HVQFN<\/strong> – Heat-sink very-thin quad flat-pack, no-leads. Labai plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173, su papildoma plok\u0161tele au\u0161inimui (angl.: thermal enhanced).
TQFP <\/strong>– Thin quad flat-pack. Plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas.
VQFP<\/strong> – Very-thin quad flat-pack. Labai plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas.
TQFN <\/strong>– Thin quad flat, no-lead. Plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173.
VQFN <\/strong>– Very-thin quad flat, no-lead. Labai plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173.
WQFN <\/strong>– Very-very-thin quad flat, no-lead. Ypatingai plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173.
UQFN <\/strong>– Ultra-thin quad flat-pack, no-lead. „Ultra” plonas keturkampis (kvadratinis) plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173.
ODFN <\/strong>– Optical dual flat, no-lead. Permatomas dvigubas plok\u0161\u010dias korpusas neturintis ilg\u0173 i\u0161vad\u0173. Lustas sumontuojamas \u012f permatom\u0105 korpus\u0105. Da\u017eniausiai toks korpusas pritaikomas optiniams davikliams.<\/p>\n\n\n\n

Small outline packages (ma\u017e\u0173 gabarit\u0173 korpusai)<\/h4>\n\n\n\n

SOP <\/strong>– Small-outline package. Ma\u017e\u0173 gabarit\u0173 korpusas.
CSOP <\/strong>– Ceramic small-outline package. Keramikinis ma\u017e\u0173 gabarit\u0173 korpusas.
DSOP <\/strong>– Dual small-outline package. Dvigubas ma\u017e\u0173 gabarit\u0173 korpusas.
HSOP <\/strong>– Thermally-enhanced small-outline package. Termi\u0161kai patobulintas ma\u017e\u0173 gabarit\u0173 korpusas.
HSSOP <\/strong>– Thermally-enhanced shrink small-outline package. Termi\u0161kai patobulintas suma\u017eintas korpusas.
HTSSOP <\/strong>– Thermally-enhanced thin shrink small-outline package. Termi\u0161kai patobulintas plonas suma\u017eintas korpusas.
mini-SOIC<\/strong> – Mini small-outline integrated circuit. Suma\u017einto korpuso mikroschema.
MSOP <\/strong>– Mini small-outline package. Suma\u017eintas ma\u017e\u0173 gabarit\u0173 korpusas.
PSOP <\/strong>– Plastic small-outline package. Plastikinis ma\u017e\u0173 gabarit\u0173 korpusas.
PSON <\/strong>– Plastic small-outline no-lead package. Plastikinis ma\u017e\u0173 gabarit\u0173 korpusas neturintis ilg\u0173 i\u0161vad\u0173.
QSOP <\/strong>– Quarter-size small-outline package. Ketvirtadalio did\u017eio ma\u017e\u0173 gabarit\u0173 korpusas. I\u0161vad\u0173 \u017eingsnis 0.635 mm.
SOIC <\/strong>– Small-outline integrated circuit. Ma\u017e\u0173 gabarit\u0173 mikroschema. Taip pat \u017einoma kaip SOIC NARROW ir SOIC WIDE.
SOJ <\/strong>– Small-outline J-leaded package. Ma\u017e\u0173 gabarit\u0173 korpusas su „J” formos kojel\u0117mis.
SON <\/strong>– Small-outline no-lead package. Ma\u017e\u0173 gabarit\u0173 korpusas neturintis ilg\u0173 i\u0161vad\u0173.
SSOP <\/strong>– Shrink small-outline package. Suma\u017eintas korpusas.
TSOP <\/strong>– Thin small-outline package. Plonas ma\u017e\u0173 gabarit\u0173 korpusas.
TSSOP <\/strong>– Thin shrink small-outline package. Plonas suma\u017eintas korpusas.
TVSOP <\/strong>– Thin very-small-outline package. Plonas ir labai ma\u017e\u0173 gabarit\u0173 korpusas.
VSOP <\/strong>– Very-small-outline package. Labai ma\u017e\u0173 gabarit\u0173 korpusas.
VSSOP <\/strong>– Very-thin shrink small-outline package. Labai plonas suma\u017eintas korpusas. Taip pat pasitaiko kaip MSOP – „Micro small-outline package”.
WSON <\/strong>– Very-very-thin small-outline no-lead package. Ypatingai plonas ma\u017e\u0173 gabarit\u0173 korpusas neturintis ilg\u0173 i\u0161vad\u0173.
USON <\/strong>– Very-very-thin small-outline no-lead package. Ypatingai plonas ma\u017e\u0173 gabarit\u0173 korpusas neturintis ilg\u0173 i\u0161vad\u0173. \u0160iek tiek ma\u017eesnis negu WSON korpusas.<\/p>\n\n\n\n

Chip-scale packages (lusto dyd\u017eio korpusai)<\/h4>\n\n\n\n

BL <\/strong>– Beam lead technology. „Spindulio” i\u0161vad\u0173 technologijos korpusas. Plikas silicio lustas (pirmasis lusto dyd\u017eio tipo korpusas).
CSP <\/strong>– Chip-scale package. Lusto dyd\u017eio korpusas. Korpusas n\u0117ra didesnis kaip 1,2X silicio lusto dyd\u017eio.
TCSP <\/strong>– True chip-size package. Lusto dyd\u017eio korpusas (tikrasis 1:1). Korpusas tokio pat dyd\u017eio kaip ir pats lustas..
TDSP <\/strong>– True die-size package. Kaip ir TCSP variantas – lusto dyd\u017eio korpusas (tikrasis 1:1).
WCSP <\/strong>arba WL-CSP<\/strong> arba WLCSP <\/strong>– Wafer-level chip-scale package. Lustas su papildomu takeli\u0173 paskirstymo sluoksniu. Papildomame sluoksnyje yra ma\u017ei i\u0161vadai (kontaktai) kurie gali lituotis prie kito pavir\u0161iaus.
PMCP<\/strong> – Power mount CSP (chip-scale package). WLCSP variantas, didelio galingumo komponentams (pvz.: MOSFET tranzistoriams). Tokio korpuso komponentus gamina Panasonic.
eWLB<\/strong> – Embedded wafer level ball grid array. Lustas su papildomu takeli\u0173 paskirstymo sluoksniu, pereinantis \u012f rutuli\u0173 matric\u0105. Modifikuotas WLCSP variantas.
MICRO SMD<\/strong> – Chip-size package (CSP). Lusto dyd\u017eio korpusas. Korpusas n\u0117ra didesnis kaip 1,2X silicio lusto dyd\u017eio. Pavadinimas naudojamas National Semiconductor gamintojo.
COB<\/strong> – Chip on board. Lustas pritvirtintas prie PCB plok\u0161t\u0117s.
COF<\/strong> – Chip-on-flex. Lustas pritvirtintas ant „Flex PCB”.
TAB <\/strong>– Tape-automated bonding. Lustas pritvirtintas ant juostos.
COG <\/strong>– Chip-on-glass. Lustas pritvirtintas ant stiklo.<\/p>\n\n\n\n

Ball grid array (rutuli\u0173 matrica arba masyvas)<\/h4>\n\n\n\n

FBGA <\/strong>– Fine-pitch ball-grid array. Smulkaus \u017eingsnio rutuli\u0173 matrica. Kvadratinis arba sta\u010diakampis litavimo rutuli\u0173 masyvas ant vieno pavir\u0161iaus.
LBGA <\/strong>– Low-profile ball-grid array. \u017demo profilio rutuli\u0173 matrica.
TEPBGA <\/strong>– Thermally-enhanced plastic ball-grid array. Termi\u0161kai patobulinta rutuli\u0173 matrica plastikiniame korpuse.
CBGA <\/strong>– Ceramic ball-grid array. Rutuli\u0173 matrica keramikiniame korpuse.
OBGA <\/strong>– Organic ball-grid array. Rutuli\u0173 matrica organinio plastiko korpuse.
TFBGA <\/strong>– Thin fine-pitch ball-grid array. Plona smulkaus \u017eingsnio rutuli\u0173 matrica.
PBGA <\/strong>– Plastic ball-grid array. Rutuli\u0173 matrica plastikiniame korpuse.
MAP-BGA<\/strong> – Mold array process – ball-grid array. Rutuli\u0173 matrica u\u017epilta specialiu u\u017epildu.
UCSP <\/strong>– Micro (\u03bc) chip-scale package. Lusto dyd\u017eio korpusas. Pana\u0161us \u012f BGA (gamina Maxim kompanija).
\u03bcBGA <\/strong>– Micro ball-grid array (Ball spacing less than 1 mm). Rutuli\u0173 matrica, kurios rutuli\u0173 \u017eingsnis yra ma\u017eesnis nei 1 mm.
LFBGA <\/strong>– Low-profile fine-pitch ball-grid array. \u017demo profilio smulkaus \u017eingsnio rutuli\u0173 matrica.
TBGA <\/strong>– Thin ball-grid array. Plona rutuli\u0173 matrica.
SBGA <\/strong>– Super ball-grid array. Rutuli\u0173 matrica, kurioje yra daugiau nei 500 rutuli\u0173.
UFBGA <\/strong>– Ultra-fine ball-grid array. Ypatingai smulkaus \u017eingsnio rutuli\u0173 matrica<\/p>\n\n\n\n

Kiti korpusai<\/h4>\n\n\n\n

MELF <\/strong>– Metal electrode leadless face. Trump\u0173 metalo elektrod\u0173 korpusas. Da\u017eniausiai tokiame korpuse gaminami SMD rezistoriai ir diodai.
SOD <\/strong>– Small-outline diode. Ma\u017e\u0173 gabarit\u0173 diodas.
SOT <\/strong>– Small-outline transistor. Ma\u017e\u0173 gabarit\u0173 tranzistorius. (pvz.: SOT-23, SOT-223, SOT-323).
TO-XX<\/strong> – THT komponent\u0173 korpusai su ilgais i\u0161vadais. Da\u017eniausiai tai yra tranzistoriai ar diodai.
Pvz.: TO-3, TO-5, TO-18, TO-39, TO-46, TO-66, TO-92, TO-99.<\/em><\/p>\n\n\n\n

Dviej\u0173 i\u0161vad\u0173 SMD komponent\u0173 korpusai<\/h4>\n\n\n\n
SMD korpuso dydis (imperial)<\/strong><\/td>Dydis milimetrais<\/strong><\/td>Dydis coliais<\/strong><\/td><\/tr>
01005<\/td>0.4 x 0.2<\/td>0.016 x 0.008<\/td><\/tr>
0201<\/td>0.6 x 0.3<\/td>0.02 x 0.01<\/td><\/tr>
0402<\/td>1.0 x 0.5<\/td>0.04 x 0.02<\/td><\/tr>
0603<\/td>1.5 x 0.8<\/td>0.06 x 0.03<\/td><\/tr>
0805<\/td>2.0 x 1.3<\/td>0.08 x 0.05<\/td><\/tr>
1008<\/td>2.5 x 2.0<\/td>0.10 x 0.08<\/td><\/tr>
1206<\/td>3.0 x 1.5<\/td>0.12 x 0.06<\/td><\/tr>
1210<\/td>3.2 x 2.5<\/td>0.125 x 0.10<\/td><\/tr>
1806<\/td>4.5 x 1.6<\/td>0.18 x 0.06<\/td><\/tr>
1812<\/td>4.6 x 3.0<\/td>0.18 x 0.125<\/td><\/tr>
1825<\/td>4.5 x 6.4<\/td>0.18 x 0.25<\/td><\/tr>
2010<\/td>5.0 x 2.5<\/td>0.20 x 0.10<\/td><\/tr>
2512<\/td>6.3 x 3.2<\/td>0.25 x 0.125<\/td><\/tr>
2725<\/td>6.9 x 6.3<\/td>0.27 x 0.25<\/td><\/tr>
2920<\/td>7.4 x 5.1<\/td>0.29 x 0.20<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Tantalini\u0173 kondensatori\u0173 korpusai<\/h4>\n\n\n\n
SMD korpuso tipas<\/strong><\/td>Dydis milimetrais<\/strong><\/td>EIA standartas<\/strong><\/td><\/tr>
Size A<\/td>3.2 x 1.6 x 1.6<\/td>EIA 3216-18<\/td><\/tr>
Size B<\/td>3.5 x 2.8 x 1.9<\/td>EIA 3528-21<\/td><\/tr>
Size C<\/td>6.0 x 3.2 x 2.2<\/td>EIA 6032-28<\/td><\/tr>
Size D<\/td>7.3 x 4.3 x 2.4<\/td>EIA 7343-31<\/td><\/tr>
Size E<\/td>7.3 x 4.3 x 4.1<\/td>EIA 7343-43<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Paruo\u0161\u0117 Andrej Galin. Kopijuoti be autoriaus leidimo draud\u017eiama.<\/em><\/p>","protected":false},"excerpt":{"rendered":"

Kompiuteri\u0173 ir mobili\u0173j\u0173 \u012frengini\u0173 pasaulis – tai pirmiausia yra elektronikos pasaulis. Elektronikos pasaulis – tai daugyb\u0117 pa\u010di\u0173 \u012fvairiausi\u0173 atskir\u0173 komponent\u0173. \u0160itame straipsnyje mes nesigilinsime \u012f komponent\u0173 pavadinimus, tipus ir j\u0173 paskirt\u012f. \u010cia mes ap\u017evelgsime pasyvi\u0173 ir aktyvi\u0173 elektronikos komponent\u0173 korpusus. Komponent\u0173 korpus\u0173 pavadinimus naudinga \u017einoti kada mes kalbame apie tam tikr\u0173 procesori\u0173 ir mikroschem\u0173 modelius. … read more<\/em><\/b><\/a><\/p>","protected":false},"author":1,"featured_media":363,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[104,97,96,102,93,94,106,92,90,91,95,103,100,105,107,108,101,110,109,112,99,111],"class_list":["post-350","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-straipsniai","tag-bga","tag-dalys","tag-detales","tag-dip","tag-elektronika","tag-elektronikos-komponentai","tag-flat","tag-komponentai","tag-komponentu-korpusai","tag-korpusai","tag-korpusas","tag-lga","tag-package","tag-plcc","tag-qfn","tag-qfp","tag-sip","tag-sod","tag-sop","tag-ssop","tag-tht","tag-tsop"],"yoast_head":"\nElektronikos komponent\u0173 korpusai - Seni kompiuteriai<\/title>\n<meta name=\"description\" content=\"Pasyvi\u0173 ir aktyvi\u0173 elektronikos komponent\u0173 korpusai. 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